1.4 110C Gravity Red Glue Adhesive Heat Resistant Glue For High Speed Dispensers

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xAppearance | Red Paste | Specific Gravity | 1.0 ~ 1.4 |
---|---|---|---|
Insulation Resistance (Ω) | ≥ 1×1012 | Thixotropy Index | ≥ 4.0 |
Curing Conditions | See 3 Page | Copper Plate Corrosion | None |
Moisture Absorption (wt%) | ≤ 1.0 | Tensile Strength (kgf/cm2) | 120 |
High Light | 1.4 Gravity Red Glue Adhesive,110C Red Glue Adhesive,heat resistant glue 1×1012 |
Suitable for high-speed dispensers light compact and easy to use
HT-130-AL red glue, epoxy resin (rapid thermal hardening effect) adhesive. Because it has the characteristics of vacuum packaging and "Shear-Thinning" Viscosity Characteristic, it is suitable for high-speed dispensers (40,000~40,500 points/hour). Because of its high temperature solidification (280℃-285℃) characteristics, this product Also suitable for lead-free soldering.
1.Application:
Bond various CHIPS on the PCB board before entering the wave soldering.
This product is especially suitable for high-speed dispensers and screen printing.
2.Process method:
Printing method
The stencil engraved holes should be determined according to the type of parts, the performance of the substrate, its thickness and the size and shape of the holes. Its advantages are fast speed and high efficiency.
3.Physical characteristics:
ITEM
|
RESULTS
|
Test Methods |
Appearance | red paste | HT-1 |
Viscosity (poise) | 500 ~ 600 | HT-2-1 |
Thixotropy index | ≥ 4.0 | HT-3-1 |
Specific gravity | 1.0 ~ 1.4 | HT-4 |
Curing conditions | See 3 Page | HT-5-1 |
Copper plate corrosion | None | HT-6-1 |
Moisture Absorption (wt%) | ≤ 1.0 | HT-7-1 |
Tensile strength (kgf/cm2) | 120 | HT-8-1 |
Insulation resistance (Ω) | ≥ 1×1012 | HT-9-1 |
Dielectric constant | ≤ 3.8 | HT-10-1 |
Glass transition temperature | ≥ 110℃ | HT-11 |
Heat resistance (280~285℃) | 11 ~ 15 sec | HT-12-2 |
Adhering strength (kg/f) | ≥ 2.0 | HT-13-1 |
Storage conditions | 5 ~ 10℃, ≤ 40% | HT-14 |
Validity period | 6 months | HT-15 |
4.Product Image: