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Sn96.5Ag3.0Cu0.5 0.3 Mm Lead Free Solid Wire Solder 500g Fast Soldering
| Place of Origin | China |
|---|---|
| Brand Name | Wuxi Top Chemical |
| Certification | ISO9001 |
| Model Number | Sn96.5Ag3.0Cu0.5 |
| Minimum Order Quantity | 1 tons |
| Price | Call/negotiable |
| Packaging Details | 1 container |
| Delivery Time | 5-8 days |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability | 50 tons/month |
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xProduct Details
| Model | Superfine Solder Wire | Material | Sn/Ag/Cu |
|---|---|---|---|
| Melting Point | 217-227°C | Specific Gravity | 7.42±0.1g/cm³ |
| Wire Diameter | 0.1~0.5mm To Choose From | Single Roll Weight | 50g/100g (customizable) |
| Shape | Linear, Filamentous | Packing | 10 Rolls/carton |
| High Light | Sn96.5Ag3.0Cu0.5 lead free wire solder,0.3 mmlead free wire solder 500g,lead free solid wire solder |
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Product Description
Very fine solder wire Sn96.5Ag3.0Cu0.5 lead-free solder wire fast soldering, good flowability
Introduction:
The ultra-fine solder wire produced by our company can be as fine as 0.1mm. It adopts brand-new equipment and unique technology. It is a new soldering ultra-fine wire specially developed for electronic packaging and IC packaging repair soldering.
Advantages:
fast soldering, good fluidity, less smoke, no cleaning, continuous threading, continuous rosin
Process:
Fully automatic extrusion, multi-aperture (two-core, three-core, four-core, five-core) tin wire is used to draw out multiple truly independent tin wires containing flux-containing holes from a single tin wire.
Specifications:
In order to meet the customer's welding process, continuous research and development are suitable for medium temperature, high temperature and low temperature welding requirements.
Features:
Fast soldering tin fast
Improve wetting performance
Good to remove the risk of blockage by rosin
Rosin is closer to the welding environment
High purity is shown by reducing the variability of molten solder
Low residue
Improve productivity
Improve reliability
Product parameters:
| Brand | TUOPU | Model | Superfine solder wire |
| Material | Sn/Ag/Cu | Melting point | 217-227°C |
| Specific gravity | 7.42±0.1g/cm³ | Wire diameter | 0.1~0.5mm to choose from |
| Single roll weight | 50g/100g (customizable) | Shape | linear, filamentous |
| Packing | 10 rolls/carton | Carton size | 33.8*16*6cm |
Product Image:
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