0.1 Mm SnAgCu Rohs Lead Free Solder Wire Continuous 217 Deg
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xModel | Superfine Solder Wire | Material | Sn/Ag/Cu |
---|---|---|---|
Melting Point | 217-227°C | Specific Gravity | 7.42±0.1g/cm³ |
Wire Diameter | 0.1~0.5mm To Choose From | Single Roll Weight | 50g/100g (customizable) |
Packing | 10 Rolls/carton | Carton Size | 33.8*16*6cm |
High Light | 0.1 mm Lead Free Solder Wire,SnAgCu Lead Free Solder Wire,rohs solder wire 217 deg |
SnAgCu ultra-fine solder wire 0.1mm continuous wire advantages solder wire
Introduction:
The ultra-fine solder wire produced by our company can be as fine as 0.1mm. It adopts brand-new equipment and unique technology. It is a new soldering ultra-fine wire specially developed for electronic packaging and IC packaging repair soldering.
Process:
Fully automatic extrusion, multi-aperture (two-core, three-core, four-core, five-core) tin wire is used to draw out multiple truly independent tin wires containing flux-containing holes from a single tin wire.
Specifications:
In order to meet the customer's welding process, continuous research and development are suitable for medium temperature, high temperature and low temperature welding requirements.
Features:
Fast soldering tin fast
Improve wetting performance
Good to remove the risk of blockage by rosin
Improve productivity
Improve reliability
Product parameters:
Brand | TUOPU |
Material | Sn/Ag/Cu |
Model | Superfine solder wire |
Melting point | 217-227°C |
Wire diameter | 0.1~0.5mm to choose from |
Shape | linear, filamentous |
Specific gravity | 7.42±0.1g/cm³ |
Single roll weight | 50g/100g (customizable) |
Packing | 10 rolls/carton |
Carton size | 33.8*16*6cm |
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