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Sn99.3Cu0.7 Lead Free Solder Wire 225 Deg Rosin Core Halogen Free Low Residue
| Place of Origin | China |
|---|---|
| Brand Name | Wuxi Top Chemical |
| Certification | ISO9001 |
| Model Number | Sn99.3Cu0.7 |
| Minimum Order Quantity | 1 tons |
| Price | Call/negotiable |
| Packaging Details | 1 container |
| Delivery Time | 5-8 days |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability | 50 tons/month |
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xProduct Details
| Model | Lead-free No-clean Solder Wire | Material | Sn99.3Cu0.7 |
|---|---|---|---|
| Melting Point | 227±2°C | Specific Gravity | 7.42±0.1g/cm³ |
| Wire Diameter | 0.4~4.0mm To Choose From | Single Roll Weight | 500g/1000g (customizable) |
| Shape | Linear, Filamentous | Packing | 10 Rolls/carton |
| High Light | Sn99.3Cu0.7 Lead Free Solder Wire,Lead Free Solder Wire 225 deg,lead free rosin core halogen free |
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Product Description
Lead-free solder wire Sn99.3Cu0.7 halogen-free solder wire No-clean low-residue solder wire
product description:
Sn99.3Cu0.7 halogen-free solder wire has the characteristics of easy soldering, reliable soldering, and good continuous solderability for soldering products. It adopts a fully automatic extrusion process, which has fast diffusion, no spatter, fast tin, and no bubbles or no bubbles in the solder joints. Cracks, smooth, shiny and full.
Process:
Fully automatic extrusion, multi-aperture (two-core, three-core, four-core, five-core) tin wire is used to draw out multiple truly independent tin wires containing flux-containing holes from a single tin wire.
Specifications:
In order to meet the customer's welding process, continuous research and development are suitable for medium temperature, high temperature and low temperature welding requirements.
Features:
Fast soldering tin fast
Improve wetting performance
Good to remove the risk of blockage by rosin
Rosin is closer to the welding environment
High purity is shown by reducing the variability of molten solder
Low residue
Improve productivity
Improve reliability
Scope of application:
5G base station peripheral materials
Automobile industry
New energy industry
Computer peripheral industry
Communication industry
Audio industry
Product parameters:
| Brand | TUOPU | Model | Lead-free no-clean solder wire |
| Material | Sn99.3Cu0.7 | Melting point | 227±2°C |
| Specific gravity | 7.42±0.1g/cm³ | Wire diameter | 0.4~4.0mm to choose from |
| Single roll weight | 500g/1000g (customizable) | Shape | linear, filamentous |
| Packing | 10 rolls/carton | Carton size | 33.8*16*6cm |
Product Image:
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