SAC305 0.8 Mm Tin Lead Free Solder Wire 500g Flux Free Solder Wire Bubble Free

Place of Origin China
Brand Name Wuxi Top Chemical
Certification ISO9001
Model Number 305
Minimum Order Quantity 1 tons
Price Call/negotiable
Packaging Details 1 container
Delivery Time 5-8 days
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 50 tons/month

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Product Details
Model Superfine Solder Wire Material 305Ag
Melting Point 227±2°C Specific Gravity 7.42±0.1g/cm³
Wire Diameter 0.4~4.0mm To Choose From Single Roll Weight 500g/1000g (customizable)
Shape Linear, Filamentous Packing 10 Rolls/carton
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SAC305 Lead Free Solder Wire


0.8 mm Lead Free Solder Wire


500g flux free solder wire

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Product Description

SAC305 silver lead-free solder wire solder joints are smooth, bright, and bubble-free high-quality tin wire



305 silver lead-free solder wire, containing 3.0 pure silver, no-cleaning and no residue, soldering is particularly firm, ordinary lead-free solder wire can’t compare with it. Excellent wettability, fast spreading speed, no spatter, no bubbles, no cracks.



Fully automatic extrusion, multi-aperture (two-core, three-core, four-core, five-core) tin wire is used to draw out multiple truly independent tin wires containing flux-containing holes from a single tin wire.


In order to meet the customer's welding process, continuous research and development are suitable for medium temperature, high temperature and low temperature welding requirements.


Fast soldering tin fast
Improve wetting performance


Product parameters:

Brand TUOPU Model  Superfine solder wire
Material  305Ag Melting point  227±2°C
Specific gravity  7.42±0.1g/cm³ Wire diameter 0.4~4.0mm to choose from
Single roll weight 500g/1000g (customizable) Shape linear, filamentous
Packing 10 rolls/carton Carton size 33.8*16*6cm

Product Image:

SAC305 0.8 Mm Tin Lead Free Solder Wire 500g Flux Free Solder Wire Bubble Free 0