SAC305 0.8 Mm Tin Lead Free Solder Wire 500g Flux Free Solder Wire Bubble Free
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|Model||Superfine Solder Wire||Material||305Ag|
|Melting Point||227±2°C||Specific Gravity||7.42±0.1g/cm³|
|Wire Diameter||0.4~4.0mm To Choose From||Single Roll Weight||500g/1000g (customizable)|
|Shape||Linear, Filamentous||Packing||10 Rolls/carton|
SAC305 Lead Free Solder Wire,
0.8 mm Lead Free Solder Wire,
500g flux free solder wire
SAC305 silver lead-free solder wire solder joints are smooth, bright, and bubble-free high-quality tin wire
305 silver lead-free solder wire, containing 3.0 pure silver, no-cleaning and no residue, soldering is particularly firm, ordinary lead-free solder wire can’t compare with it. Excellent wettability, fast spreading speed, no spatter, no bubbles, no cracks.
Fully automatic extrusion, multi-aperture (two-core, three-core, four-core, five-core) tin wire is used to draw out multiple truly independent tin wires containing flux-containing holes from a single tin wire.
In order to meet the customer's welding process, continuous research and development are suitable for medium temperature, high temperature and low temperature welding requirements.
Fast soldering tin fast
Improve wetting performance
|Brand||TUOPU||Model||Superfine solder wire|
|Specific gravity||7.42±0.1g/cm³||Wire diameter||0.4~4.0mm to choose from|
|Single roll weight||500g/1000g (customizable)||Shape||linear, filamentous|
|Packing||10 rolls/carton||Carton size||33.8*16*6cm|