All Products
Contact Person :
Zhang
Phone Number :
13906180575
Tin Lead Sn35Pb65 250C Rosin Flux No Clean Solder Paste For Electronics Low Melting Point
| Material: | SnPb |
|---|---|
| Melting Point: | 248±2°C |
| Specific Gravity: | 9.5±0.1g/cm³ |
Gray 20um 217 Deg No Clean Lead Free Solder Paste Melting Temperature Auxiliary Materials
| Product Name:: | Lead-free Solder Paste |
|---|---|
| Melting Point:: | 217 ℃ |
| Tin Powder Particle Size:: | 20～45um |
45um Low Temperature Soldering Paste Sn99.3Cu0.7 No Clean Lead Free
| Product Name:: | Lead-free Solder Paste |
|---|---|
| Melting Point: | 221 ℃ |
| Tin Powder Particle Size: | 20～45um |
Sn64.7Bi35Ag0.3 Soft Solder Paste Flux 183 Deg Lead Free Medium Temperature
| Material: | SnBiAg |
|---|---|
| Melting Point: | 183±2°C |
| Specific Gravity: | 7.4±0.1g/cm³ |
500g Sn63Pb37 Leaded Soldering Paste For Smd Components Low Melting Point
| Material: | SnPb |
|---|---|
| Melting Point: | 183±2°C |
| Specific Gravity: | 8.3±0.1g/cm³ |
Sn15Pb85 Tin Lead Soldering Paste 25μM Powder 288C Melting Point Gray
| Material: | SnPb |
|---|---|
| Melting Point: | 288±2°C |
| Specific Gravity: | 10.3±0.1g/cm³ |
Sn50Pb50 45μM Powder Solder Paste Lead Tinning Low Melting Point
| Material: | SnPb |
|---|---|
| Melting Point: | 215±2°C |
| Specific Gravity: | 8.9±0.1g/cm³ |
Lead Free Flux Soldering Paste 232 Deg For Various Circuit Boards
| Material: | Sn |
|---|---|
| Melting Point: | 232±2°C |
| Specific Gravity: | 7.41±0.1g/cm³ |
Sn99Ag0.3Cu0.7 Soldering Paste High Temperature Solder Tinning Paste 221C
| Product Name:: | Lead-free Solder Paste |
|---|---|
| Melting Point:: | 221 ℃ |
| Tin Powder Particle Size:: | 20～45um |
Alkylated Resins Electrical Insulating Varnish Conformal Coating Material Types
| Appearance: | Full Gloss/varnish |
|---|---|
| Three Anti-paint: | Alkylated Resin |
| Color: | ≤5 Gardner (Gardner Standard) |