Tin Lead Sn35Pb65 250C Rosin Flux No Clean Solder Paste For Electronics Low Melting Point
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xMaterial | SnPb | Melting Point | 248±2°C |
---|---|---|---|
Specific Gravity | 9.5±0.1g/cm³ | Powder Particle Size | 25~45μm |
Single Roll Weight | 500g/bottle | Packing | 10 Rolls/carton |
Working Temperature | 370±20℃ | Shipment Form | Put An Ice Bag Or Dry Ice In The Foam Plastic Box To Prevent High Temperature |
High Light | tin lead no clean solder paste,Sn35Pb65 no clean solder paste,250C rosin flux paste for electronics |
Sn35Pb65 solder paste Leaded solder paste Low melting point tin-lead solder paste
The 35/65 solder paste produced by our company is a low melting point, 248 temperature lead solder paste. It has the advantages of low void ratio, fast tin climbing, good continuous solderability, and excellent wettability.
Advantage:
1. Selected high-purity cloud tin
2. Produce strictly according to national standard
3. More than a dozen quality inspection links
4. Four quality system certification
It is suitable for the welding of common circuit boards, such as: home appliances, electrical meters, automotive electrical appliances, hardware appliances and other products.
Product parameters:
Brand | TUOPU | Category | 35/65 solder paste |
Material |
SnPb |
Melting point | 248±2°C |
Specific gravity | 9.5±0.1g/cm³ | Powder particle size | 25~45μm |
Single roll weight | 500g/bottle | Shipment form | put an ice bag or dry ice in the foam plastic box to prevent high temperature |
Packing | 10 rolls/carton | Working temperature | 370±20℃ |
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