Tin Lead Sn35Pb65 250C Rosin Flux No Clean Solder Paste For Electronics Low Melting Point
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|Specific Gravity||9.5±0.1g/cm³||Powder Particle Size||25~45μm|
|Single Roll Weight||500g/bottle||Packing||10 Rolls/carton|
|Working Temperature||370±20℃||Shipment Form||Put An Ice Bag Or Dry Ice In The Foam Plastic Box To Prevent High Temperature|
tin lead no clean solder paste,
Sn35Pb65 no clean solder paste,
250C rosin flux paste for electronics
Sn35Pb65 solder paste Leaded solder paste Low melting point tin-lead solder paste
The 35/65 solder paste produced by our company is a low melting point, 248 temperature lead solder paste. It has the advantages of low void ratio, fast tin climbing, good continuous solderability, and excellent wettability.
1. Selected high-purity cloud tin
2. Produce strictly according to national standard
3. More than a dozen quality inspection links
4. Four quality system certification
It is suitable for the welding of common circuit boards, such as: home appliances, electrical meters, automotive electrical appliances, hardware appliances and other products.
|Brand||TUOPU||Category||35/65 solder paste|
|Specific gravity||9.5±0.1g/cm³||Powder particle size||25~45μm|
|Single roll weight||500g/bottle||Shipment form||put an ice bag or dry ice in the foam plastic box to prevent high temperature|
|Packing||10 rolls/carton||Working temperature||370±20℃|