Tin Lead Sn35Pb65 250C Rosin Flux No Clean Solder Paste For Electronics Low Melting Point

Place of Origin China
Brand Name Wuxi Top Chemical
Certification ISO9001
Model Number Sn35Pb65
Minimum Order Quantity 1 tons
Price Call/negotiable
Packaging Details 1 container
Delivery Time 5-8 days
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 50 tons/month

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Product Details
Material SnPb Melting Point 248±2°C
Specific Gravity 9.5±0.1g/cm³ Powder Particle Size 25~45μm
Single Roll Weight 500g/bottle Packing 10 Rolls/carton
Working Temperature 370±20℃ Shipment Form Put An Ice Bag Or Dry Ice In The Foam Plastic Box To Prevent High Temperature
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tin lead no clean solder paste


Sn35Pb65 no clean solder paste


250C rosin flux paste for electronics

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Product Description

Sn35Pb65 solder paste Leaded solder paste Low melting point tin-lead solder paste


The 35/65 solder paste produced by our company is a low melting point, 248 temperature lead solder paste. It has the advantages of low void ratio, fast tin climbing, good continuous solderability, and excellent wettability.



1. Selected high-purity cloud tin
2. Produce strictly according to national standard
3. More than a dozen quality inspection links
4. Four quality system certification


It is suitable for the welding of common circuit boards, such as: home appliances, electrical meters, automotive electrical appliances, hardware appliances and other products.


Product parameters:

Brand TUOPU Category 35/65 solder paste


Melting point 248±2°C
Specific gravity 9.5±0.1g/cm³ Powder particle size 25~45μm
Single roll weight 500g/bottle Shipment form put an ice bag or dry ice in the foam plastic box to prevent high temperature
Packing 10 rolls/carton Working temperature 370±20℃


Product Image:

Tin Lead Sn35Pb65 250C Rosin Flux No Clean Solder Paste For Electronics Low Melting Point 0