Gray 20um 217 Deg No Clean Lead Free Solder Paste Melting Temperature Auxiliary Materials

Place of Origin China
Brand Name Wuxi Top Chemical
Certification ISO9001
Model Number 9308
Minimum Order Quantity 1 tons
Price Call/negotiable
Packaging Details 1 container
Delivery Time 5-8 days
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 50 tons/month

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Product Details
Product Name Lead-free Solder Paste Melting Point 217 ℃
Tin Powder Particle Size 20~45um The Shape Of Tin Powder Spherical
Flux Content 10.5±0.5 Wt% Viscosity 200 Pa.s
Insulation Resistance Test (40℃, 90%) 1×1012Ω Or More Electrical Migration (40℃, 90%) 5×1012Ω Or More
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20 um liquid paste for soldering


217 deg liquid paste for soldering


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Product Description
Solder paste lead-free solder paste solder auxiliary materials No-clean solder paste Gray solder paste
1. Introduction
9308 solder paste is composed of special flux and low oxidation spherical solder powder, which is lead-free and environmentally friendly. It adopts high-performance thixotropic agent and has excellent solubility and durability. It is suitable for the placement of fine-pitch devices (QFP, etc.).
2. Features
(1) This product is a no-clean type, with very few residues after welding, it can achieve superior test performance without cleaning, and has a very high surface insulation resistance.
(2) Stable continuous printing, excellent release after printing for a long time, suitable for placement of fine pitch devices (0.4mm). The solvent evaporates slowly and can be printed for a long time without affecting the printing viscosity of the solder paste. The viscosity is moderate and the thixotropy is good, and it is not easy to collapse during and after printing, which significantly reduces the occurrence of welding and bridging.
(3) Excellent wetting performance during soldering, no solder ball phenomenon. Effectively improve the occurrence of short circuits. After welding, the solder joints have good gloss, high strength and excellent electrical conductivity.


5. Precautions for Quality Assurance Use
The quality guarantee period is within 6 months from the production date, but it must be sealed and stored at 2-10°C. If the storage period is exceeded, please scrap it to ensure the quality of production. Before use, be sure to bring it back to room temperature (it takes about 2 hours at 25°C), and stir for 3-5 minutes before using.


7. Device requirements
(1) Scraper
1.Type: 80~90º rubber scraper, stainless steel scraper, copper scraper or aluminum scraper.
2. Speed: 0.5~2.0 meters/second (the best speed is 0.5~1.0 meters/second).
3.Pressure: 1.0~1.5 Ib/meter of squeegee pressure.
4. Angle: 50~60º
(2) Steel version
1. Thickness: The thickness of the steel plate when the 9308 solder paste is placed on the SMD is 0.2~0.12mm or 0.65~0.4mm pitch SMD.
2.Type: Steel plate can be provided by chemical etching agent, laser cutting, or a mixture of chemical and laser.
3. Pitch: It is recommended that the height be 0~0.5mm during printing. For most printings that are separated from the speed control system, the spacing of the PCB is usually recommended. If the printing does not leave a proper spacing, you should choose a lower tin Good solder paste.
(3) Environment
1. Temperature: 18~25℃.
2.Humidity: 40~60%RH
(4) Reflow
9308 solder paste is designed for infrared gas convection, heat transfer or air lead-free reflow machines. It can also be used in an atmosphere without air or nitrogen. It is recommended to use it according to the time temperature curve of TUO PU solder paste.

8. Shelf life
The storage period of used solder paste is 3 months at room temperature, and 6 months under freezing conditions (2~10℃). It is not recommended to store the solder paste below 0℃, which may harm the solder paste Flexibility.


3. Solder paste composition and others
(1) Alloy composition
project alloy composition
(Sn) Tin content 96.5%
(Ag) Silver content 3%
(Cu) Copper content 0.5%

(2) Melting temperature and others

Melting point 217 ℃
Tin powder particle size 20~45um
The shape of tin powder Spherical

(3) Flux ratio and viscosity

Flux content 10.5±0.5 wt%
Viscosity 200 Pa.s

4. Reliable performance

project Characteristics
Chloride Bromide Test Not detected (silver chromate paper test: no discoloration)
Copper plate corrosion test No corrosion
Insulation resistance test (40℃, 90%) 1×1012Ω or more
Electrical migration (40℃, 90%) 5×1012Ω or more
Mobility No bridging phenomenon above 0.4mm
Diffusion rate 93% or more



6. Packaging

Container Package net weight
PE wide mouth sealed container 500g

Gray 20um 217 Deg No Clean Lead Free Solder Paste Melting Temperature Auxiliary Materials 0