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Gray 20um 217 Deg No Clean Lead Free Solder Paste Melting Temperature Auxiliary Materials
| Place of Origin | China |
|---|---|
| Brand Name | Wuxi Top Chemical |
| Certification | ISO9001 |
| Model Number | 9308 |
| Minimum Order Quantity | 1 tons |
| Price | Call/negotiable |
| Packaging Details | 1 container |
| Delivery Time | 5-8 days |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability | 50 tons/month |
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xProduct Details
| Product Name | Lead-free Solder Paste | Melting Point | 217 ℃ |
|---|---|---|---|
| Tin Powder Particle Size | 20～45um | The Shape Of Tin Powder | Spherical |
| Flux Content | 10.5±0.5 Wt% | Viscosity | 200 Pa.s |
| Insulation Resistance Test (40℃, 90%) | 1×1012Ω Or More | Electrical Migration (40℃, 90%) | 5×1012Ω Or More |
| High Light | 20 um liquid paste for soldering,217 deg liquid paste for soldering,no clean solder auxiliary materials |
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Product Description
Solder paste lead-free solder paste solder auxiliary materials No-clean solder paste Gray solder paste
1. Introduction
9308 solder paste is composed of special flux and low oxidation spherical solder powder, which is lead-free and environmentally friendly. It adopts high-performance thixotropic agent and has excellent solubility and durability. It is suitable for the placement of fine-pitch devices (QFP, etc.).
2. Features
(1) This product is a no-clean type, with very few residues after welding, it can achieve superior test performance without cleaning, and has a very high surface insulation resistance.
(2) Stable continuous printing, excellent release after printing for a long time, suitable for placement of fine pitch devices (0.4mm). The solvent evaporates slowly and can be printed for a long time without affecting the printing viscosity of the solder paste. The viscosity is moderate and the thixotropy is good, and it is not easy to collapse during and after printing, which significantly reduces the occurrence of welding and bridging.
(3) Excellent wetting performance during soldering, no solder ball phenomenon. Effectively improve the occurrence of short circuits. After welding, the solder joints have good gloss, high strength and excellent electrical conductivity.
5. Precautions for Quality Assurance Use
The quality guarantee period is within 6 months from the production date, but it must be sealed and stored at 2-10°C. If the storage period is exceeded, please scrap it to ensure the quality of production. Before use, be sure to bring it back to room temperature (it takes about 2 hours at 25°C), and stir for 3-5 minutes before using.
7. Device requirements
(1) Scraper
1.Type: 80~90º rubber scraper, stainless steel scraper, copper scraper or aluminum scraper.
2. Speed: 0.5~2.0 meters/second (the best speed is 0.5~1.0 meters/second).
3.Pressure: 1.0~1.5 Ib/meter of squeegee pressure.
4. Angle: 50~60º
(2) Steel version
1. Thickness: The thickness of the steel plate when the 9308 solder paste is placed on the SMD is 0.2~0.12mm or 0.65~0.4mm pitch SMD.
2.Type: Steel plate can be provided by chemical etching agent, laser cutting, or a mixture of chemical and laser.
3. Pitch: It is recommended that the height be 0~0.5mm during printing. For most printings that are separated from the speed control system, the spacing of the PCB is usually recommended. If the printing does not leave a proper spacing, you should choose a lower tin Good solder paste.
(3) Environment
1. Temperature: 18~25℃.
2.Humidity: 40~60%RH
(4) Reflow
9308 solder paste is designed for infrared gas convection, heat transfer or air lead-free reflow machines. It can also be used in an atmosphere without air or nitrogen. It is recommended to use it according to the time temperature curve of TUO PU solder paste.
8. Shelf life
The storage period of used solder paste is 3 months at room temperature, and 6 months under freezing conditions (2~10℃). It is not recommended to store the solder paste below 0℃, which may harm the solder paste Flexibility.
3. Solder paste composition and others
(1) Alloy composition
(1) Alloy composition
| project | alloy composition |
| (Sn) Tin content | 96.5% |
| (Ag) Silver content | 3% |
| (Cu) Copper content | 0.5% |
(2) Melting temperature and others
| Melting point | 217 ℃ |
| Tin powder particle size | 20～45um |
| The shape of tin powder | Spherical |
(3) Flux ratio and viscosity
| Flux content | 10.5±0.5 wt% |
| Viscosity | 200 Pa.s |
4. Reliable performance
| project | Characteristics |
| Chloride Bromide Test | Not detected (silver chromate paper test: no discoloration) |
| Copper plate corrosion test | No corrosion |
| Insulation resistance test (40℃, 90%) | 1×1012Ω or more |
| Electrical migration (40℃, 90%) | 5×1012Ω or more |
| Mobility | No bridging phenomenon above 0.4mm |
| Diffusion rate | 93% or more |
6. Packaging
| Container | Package net weight |
| PE wide mouth sealed container | 500g |
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