Sn99Ag0.3Cu0.7 Soldering Paste High Temperature Solder Tinning Paste 221C

Place of Origin China
Brand Name Wuxi Top Chemical
Certification ISO9001
Model Number Sn99Ag0.3Cu0.7
Minimum Order Quantity 1 tons
Price Call/negotiable
Packaging Details 1 container
Delivery Time 5-8 days
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 50 tons/month

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Product Details
Product Name Lead-free Solder Paste Melting Point 221 ℃
Tin Powder Particle Size 20~45um The Shape Of Tin Powder Spherical
Flux Content 10.5±0.5 Wt% Viscosity 200 Pa.s
Insulation Resistance Test (40℃, 90%) 1×1012Ω Or More Electrical Migration (40℃, 90%) 5×1012Ω Or More
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Sn99Ag0.3Cu0.7 Soldering Paste


No clean Soldering Paste


solder tinning paste 221C

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Product Description
No-clean solder paste Sn99Ag0.3Cu0.7 high temperature solder paste gray paste
1. Introduction
 Sn99Ag0.3Cu0.7 solder paste is composed of special flux and low oxidation spherical solder powder, which is lead-free and environmentally friendly. It adopts high-performance thixotropic agent and has excellent solubility and durability. It is Suitable for high-end electronic products, export-quality electronic and electrical industrial products.
2. Features
(1) This product is a no-clean type, with very few residues after welding, it can achieve superior test performance without cleaning, and has a very high surface insulation resistance.
(2) Excellent wetting performance during soldering, no solder ball phenomenon. Effectively improve the occurrence of short circuits. After welding, the solder joints have good gloss, high strength and excellent electrical conductivity.
3. Solder paste composition and others
(1) Alloy composition
project alloy composition
(Sn) Tin content 99%
(Ag) Silver content 0.3%
(Cu) Copper content 0.7%

(2) Melting temperature and others

Melting point 221 ℃
Tin powder particle size 20~45um
The shape of tin powder Spherical

(3) Flux ratio and viscosity

Flux content 10.5±0.5 wt%
Viscosity 200 Pa.s

4. Reliable performance

project Characteristics
Chloride Bromide Test Not detected (silver chromate paper test: no discoloration)
Copper plate corrosion test No corrosion
Insulation resistance test (40℃, 90%) 1×1012Ω or more
Electrical migration (40℃, 90%) 5×1012Ω or more
Mobility No bridging phenomenon above 0.4mm
Diffusion rate 93% or more


5. Packaging

Container Package net weight
PE wide mouth sealed container 500g


6.Solder paste picture:

Sn99Ag0.3Cu0.7 Soldering Paste High Temperature Solder Tinning Paste 221C 0