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Sn99Ag0.3Cu0.7 Soldering Paste High Temperature Solder Tinning Paste 221C
| Place of Origin | China |
|---|---|
| Brand Name | Wuxi Top Chemical |
| Certification | ISO9001 |
| Model Number | Sn99Ag0.3Cu0.7 |
| Minimum Order Quantity | 1 tons |
| Price | Call/negotiable |
| Packaging Details | 1 container |
| Delivery Time | 5-8 days |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability | 50 tons/month |
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xProduct Details
| Product Name | Lead-free Solder Paste | Melting Point | 221 ℃ |
|---|---|---|---|
| Tin Powder Particle Size | 20～45um | The Shape Of Tin Powder | Spherical |
| Flux Content | 10.5±0.5 Wt% | Viscosity | 200 Pa.s |
| Insulation Resistance Test (40℃, 90%) | 1×1012Ω Or More | Electrical Migration (40℃, 90%) | 5×1012Ω Or More |
| High Light | Sn99Ag0.3Cu0.7 Soldering Paste,No clean Soldering Paste,solder tinning paste 221C |
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Product Description
No-clean solder paste Sn99Ag0.3Cu0.7 high temperature solder paste gray paste
1. Introduction
Sn99Ag0.3Cu0.7 solder paste is composed of special flux and low oxidation spherical solder powder, which is lead-free and environmentally friendly. It adopts high-performance thixotropic agent and has excellent solubility and durability. It is Suitable for high-end electronic products, export-quality electronic and electrical industrial products.
2. Features
(1) This product is a no-clean type, with very few residues after welding, it can achieve superior test performance without cleaning, and has a very high surface insulation resistance.
(2) Excellent wetting performance during soldering, no solder ball phenomenon. Effectively improve the occurrence of short circuits. After welding, the solder joints have good gloss, high strength and excellent electrical conductivity.
3. Solder paste composition and others
(1) Alloy composition
(1) Alloy composition
| project | alloy composition |
| (Sn) Tin content | 99% |
| (Ag) Silver content | 0.3% |
| (Cu) Copper content | 0.7% |
(2) Melting temperature and others
| Melting point | 221 ℃ |
| Tin powder particle size | 20～45um |
| The shape of tin powder | Spherical |
(3) Flux ratio and viscosity
| Flux content | 10.5±0.5 wt% |
| Viscosity | 200 Pa.s |
4. Reliable performance
| project | Characteristics |
| Chloride Bromide Test | Not detected (silver chromate paper test: no discoloration) |
| Copper plate corrosion test | No corrosion |
| Insulation resistance test (40℃, 90%) | 1×1012Ω or more |
| Electrical migration (40℃, 90%) | 5×1012Ω or more |
| Mobility | No bridging phenomenon above 0.4mm |
| Diffusion rate | 93% or more |
5. Packaging
| Container | Package net weight |
| PE wide mouth sealed container | 500g |
6.Solder paste picture:
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