Sn60Pb40 192 Deg Low Temperature Solder Paste Low Melting Point Tin Lead
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xMaterial | SnPb | Melting Point | 190±2°C |
---|---|---|---|
Specific Gravity | 8.4±0.1g/cm³ | Powder Particle Size | 25~45μm |
Single Roll Weight | 500g/bottle | Packing | 10 Rolls/carton |
Working Temperature | 340±20℃ | Shipment Form | Put An Ice Bag Or Dry Ice In The Foam Plastic Box To Prevent High Temperature |
High Light | Sn60Pb40 low temperature solder paste,192 deg low temperature solder paste,electric flux paste tin lead ODM |
Sn60Pb40 solder paste Leaded solder paste Low melting point tin-lead solder paste
The 60/40 solder paste produced by our company is a low melting point, 190 temperature lead solder paste. It has the advantages of low void ratio, fast tin climbing, good continuous solderability, and excellent wettability.
It is suitable for the welding of circuit boards with higher requirements, such as: high-precision instruments, electronics industry, communications, micro technology, aviation industry and other products.
Advantage:
1. Selected high-purity cloud tin
2. Produce strictly according to national standard
3. More than a dozen quality inspection links
4. Four quality system certification
Product parameters:
Brand | TUOPU | Category | 60/40 solder paste |
Material |
SnPb |
Melting point | 190±2°C |
Specific gravity | 8.4±0.1g/cm³ | Powder particle size | 25~45μm |
Single roll weight | 500g/bottle | Shipment form | put an ice bag or dry ice in the foam plastic box to prevent high temperature |
Packing | 10 rolls/carton | Working temperature | 340±20℃ |
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