All Products
Contact Person :
Zhang
Phone Number :
13906180575
45um Low Temperature Soldering Paste Sn99.3Cu0.7 No Clean Lead Free
| Place of Origin | China |
|---|---|
| Brand Name | Wuxi Top Chemical |
| Certification | ISO9001 |
| Model Number | Sn99.3Cu0.7 |
| Minimum Order Quantity | 1 tons |
| Price | Call/negotiable |
| Packaging Details | 1 container |
| Delivery Time | 5-8 days |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability | 50 tons/month |
Contact me for free samples and coupons.
Whatsapp:0086 18588475571
Wechat: 0086 18588475571
Skype: sales10@aixton.com
If you have any concern, we provide 24-hour online help.
xProduct Details
| Product Name | Lead-free Solder Paste | Melting Point | 221 ℃ |
|---|---|---|---|
| Tin Powder Particle Size | 20～45um | The Shape Of Tin Powder | Spherical |
| Flux Content | 10.5±0.5 Wt% | Viscosity | 200 Pa.s |
| Insulation Resistance Test (40℃, 90%) | 1×1012Ω Or More | Electrical Migration (40℃, 90%) | 5×1012Ω Or More |
| High Light | 45um lead free Soldering Paste,Soldering Paste Sn99.3Cu0.7,low temperature solder paste Lead free |
||
Product Description
Lead-free solder paste Soldering material Gray paste Paste mixture
1. Product Description
Sn99.3Cu0.7 no-clean solder paste is a normal temperature solder paste, which has the advantages of no-cleaning, no residue, low void rate, fast soldering, good continuous solderability, excellent wettability, fast spreading speed, and solder joints. No bubbles.
2.Product Features:
* Improve yield and output
* No-washing, low residue, excellent electrical properties
* Stronger heat resistance, wettability and stability
* It has excellent wettability and will not produce tin beads
* High viscosity
* Improve yield and output
* No-washing, low residue, excellent electrical properties
* Stronger heat resistance, wettability and stability
* It has excellent wettability and will not produce tin beads
* High viscosity
3.Performance Testing:
Collapsibility test (close spacing, low void)
Test condition: based on JIS Z328
Standard steel mesh thickness: 150μm
Heating conditions: 180℃*120sec
Collapsibility test (close spacing, low void)
Test condition: based on JIS Z328
Standard steel mesh thickness: 150μm
Heating conditions: 180℃*120sec
4. Reliable performance
| project | Characteristics |
| Chloride Bromide Test | Not detected (silver chromate paper test: no discoloration) |
| Copper plate corrosion test | No corrosion |
| Insulation resistance test (40℃, 90%) | 1×1012Ω or more |
| Electrical migration (40℃, 90%) | 5×1012Ω or more |
| Mobility | No bridging phenomenon above 0.4mm |
| Diffusion rate | 93% or more |
5. Product parameters:
| Brand: TUOPU | Category: No-clean solder paste |
| Material: Sn/Cu | Melting point: 227±2℃ |
| Specific gravity: 7.4±0.1g/cm³ | Powder particle size: 25~45μm |
| Shape: Paste | Single bottle weight: 500g/bottle |
| Packing specification: 10KG/carton | Shipment form: put an ice bag or dry ice in the foam plastic box to prevent high temperature |
6.Product Image:
Recommended Products