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Sn64.7Bi35Ag0.3 Soft Solder Paste Flux 183 Deg Lead Free Medium Temperature
| Place of Origin | China |
|---|---|
| Brand Name | Wuxi Top Chemical |
| Certification | ISO9001 |
| Model Number | Sn64.7Bi35Ag0.3 |
| Minimum Order Quantity | 1 tons |
| Price | Call/negotiable |
| Packaging Details | 1 container |
| Delivery Time | 5-8 days |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability | 50 tons/month |
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xProduct Details
| Material | SnBiAg | Melting Point | 183±2°C |
|---|---|---|---|
| Specific Gravity | 7.4±0.1g/cm³ | Powder Particle Size | 25~45μm |
| Single Roll Weight | 500g/bottle | Shipment Form | Put An Ice Bag Or Dry Ice In The Foam Plastic Box To Prevent High Temperature |
| Packing | 10 Rolls/carton | Corrugated Box Size | 290W*350L*215Hmm |
| High Light | Sn64.7Bi35Ag0.3 Soldering Paste,Soldering Paste 183 deg,soft solder paste flux Lead free |
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Product Description
Lead-free medium temperature solder paste Sn64.7Bi35Ag0.3 solder paste
The lead-free medium-temperature solder paste produced by TUOPU is a medium-temperature solder paste with no-cleaning, no residue, low void rate, fast solder climbing, good continuous solderability, excellent wettability, fast spreading speed, and no bubbles in the solder joints. , No cracks, smooth, bright and full.
Introduction:
This lead-free medium temperature solder paste can be provided in various alloy forms and packages, with various powder diameters, metal alloy content and viscosity adjustments. The company's technology contains active flux paste and low tin oxide powder.
Scope of application:
5G base station peripheral materials
Automobile industry
New energy industry
Computer peripheral industry
Communication industry
Audio industry
Features:
| Improve yield and output | High viscosity, low void rate |
| No-clean, low residue, excellent electrical properties | Demonstrates excellent and stable printing performance on tiny pads with 0.3mm pitch |
| Heat resistance, wettability, stronger stability | Good fluidity, not easy to cause collapse and bridging when placed or dissipated |
| Has excellent wettability and will not produce tin beads | Low residue, no foul odor, non-corrosive |
| It can be placed for a long time after printing, it can be placed for 12-14 hours at room temperature | The solder joints are firm, no bubbles, no cracks, smooth, bright and full |
Product parameters:
| Brand | TUOPU | Category | Lead-free medium temperature solder paste |
| Material | SnBiAg0.3 (content of 0.1Ag, 1.0Ag can be customized) | Melting point | 183±2°C |
| Specific gravity | 7.4±0.1g/cm³ | Powder particle size | 25~45μm |
| Single roll weight | 500g/bottle | Shipment form | put an ice bag or dry ice in the foam plastic box to prevent high temperature |
| Packing | 10 rolls/carton | Corrugated box size | 290W*350L*215Hmm |
Product Image:
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