Sn64.7Bi35Ag0.3 Soft Solder Paste Flux 183 Deg Lead Free Medium Temperature

Place of Origin China
Brand Name Wuxi Top Chemical
Certification ISO9001
Model Number Sn64.7Bi35Ag0.3
Minimum Order Quantity 1 tons
Price Call/negotiable
Packaging Details 1 container
Delivery Time 5-8 days
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 50 tons/month

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Product Details
Material SnBiAg Melting Point 183±2°C
Specific Gravity 7.4±0.1g/cm³ Powder Particle Size 25~45μm
Single Roll Weight 500g/bottle Shipment Form Put An Ice Bag Or Dry Ice In The Foam Plastic Box To Prevent High Temperature
Packing 10 Rolls/carton Corrugated Box Size 290W*350L*215Hmm
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Sn64.7Bi35Ag0.3 Soldering Paste


Soldering Paste 183 deg


soft solder paste flux Lead free

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Product Description

Lead-free medium temperature solder paste Sn64.7Bi35Ag0.3 solder paste


The lead-free medium-temperature solder paste produced by TUOPU is a medium-temperature solder paste with no-cleaning, no residue, low void rate, fast solder climbing, good continuous solderability, excellent wettability, fast spreading speed, and no bubbles in the solder joints. , No cracks, smooth, bright and full.


This lead-free medium temperature solder paste can be provided in various alloy forms and packages, with various powder diameters, metal alloy content and viscosity adjustments. The company's technology contains active flux paste and low tin oxide powder.


Scope of application:
5G base station peripheral materials
Automobile industry
New energy industry
Computer peripheral industry
Communication industry
Audio industry



Improve yield and output High viscosity, low void rate
No-clean, low residue, excellent electrical properties Demonstrates excellent and stable printing performance on tiny pads with 0.3mm pitch
Heat resistance, wettability, stronger stability Good fluidity, not easy to cause collapse and bridging when placed or dissipated
Has excellent wettability and will not produce tin beads Low residue, no foul odor, non-corrosive
It can be placed for a long time after printing, it can be placed for 12-14 hours at room temperature The solder joints are firm, no bubbles, no cracks, smooth, bright and full


Product parameters:

Brand TUOPU Category Lead-free medium temperature solder paste
Material SnBiAg0.3 (content of 0.1Ag, 1.0Ag can be customized) Melting point 183±2°C
Specific gravity 7.4±0.1g/cm³ Powder particle size 25~45μm
Single roll weight 500g/bottle Shipment form put an ice bag or dry ice in the foam plastic box to prevent high temperature
Packing 10 rolls/carton Corrugated box size 290W*350L*215Hmm

Product Image:

Sn64.7Bi35Ag0.3 Soft Solder Paste Flux 183 Deg Lead Free Medium Temperature 0