500g Sn63Pb37 Leaded Soldering Paste For Smd Components Low Melting Point
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xMaterial | SnPb | Melting Point | 183±2°C |
---|---|---|---|
Specific Gravity | 8.3±0.1g/cm³ | Powder Particle Size | 25~45μm |
Single Roll Weight | 500g/bottle | Packing | 10 Rolls/carton |
Corrugated Box Size | 290W*350L*215Hmm | Shipment Form | Put An Ice Bag Or Dry Ice In The Foam Plastic Box To Prevent High Temperature |
High Light | 500g Soldering Paste,Sn63Pb37 Soldering Paste,Leaded solder paste for smd components |
Sn63Pb37 solder paste Leaded solder paste Low melting point tin-lead solder paste
The 63/37 solder paste produced by our company is a low melting point, 183 temperature lead solder paste. It has the advantages of low void ratio, fast tin climbing, good continuous solderability, and excellent wettability.
Advantage:
1. Selected high-purity cloud tin
2. Produce strictly according to national standard
3. More than a dozen quality inspection links
4. Four quality system certification
Scope of application:
It is suitable for the welding of circuit boards with higher requirements, such as: high-precision instruments, electronics industry, communications, micro technology, aviation industry and other products.
Product parameters:
Brand | TUOPU | Category | 63/37 solder paste |
Material |
SnPb |
Melting point | 183±2°C |
Specific gravity | 8.3±0.1g/cm³ | Powder particle size | 25~45μm |
Single roll weight | 500g/bottle | Shipment form | put an ice bag or dry ice in the foam plastic box to prevent high temperature |
Packing | 10 rolls/carton | Corrugated box size | 290W*350L*215Hmm |
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