500g Sn63Pb37 Leaded Soldering Paste For Smd Components Low Melting Point

Place of Origin China
Brand Name Wuxi Top Chemical
Certification ISO9001
Model Number Sn63Pb37
Minimum Order Quantity 1 tons
Price Call/negotiable
Packaging Details 1 container
Delivery Time 5-8 days
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 50 tons/month

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Product Details
Material SnPb Melting Point 183±2°C
Specific Gravity 8.3±0.1g/cm³ Powder Particle Size 25~45μm
Single Roll Weight 500g/bottle Packing 10 Rolls/carton
Corrugated Box Size 290W*350L*215Hmm Shipment Form Put An Ice Bag Or Dry Ice In The Foam Plastic Box To Prevent High Temperature
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500g Soldering Paste


Sn63Pb37 Soldering Paste


Leaded solder paste for smd components

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Product Description

Sn63Pb37 solder paste Leaded solder paste Low melting point tin-lead solder paste


The 63/37 solder paste produced by our company is a low melting point, 183 temperature lead solder paste. It has the advantages of low void ratio, fast tin climbing, good continuous solderability, and excellent wettability.



1. Selected high-purity cloud tin
2. Produce strictly according to national standard
3. More than a dozen quality inspection links
4. Four quality system certification


Scope of application:
It is suitable for the welding of circuit boards with higher requirements, such as: high-precision instruments, electronics industry, communications, micro technology, aviation industry and other products.


Product parameters:

Brand TUOPU Category 63/37 solder paste


Melting point 183±2°C
Specific gravity 8.3±0.1g/cm³ Powder particle size 25~45μm
Single roll weight 500g/bottle Shipment form put an ice bag or dry ice in the foam plastic box to prevent high temperature
Packing 10 rolls/carton Corrugated box size 290W*350L*215Hmm


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500g Sn63Pb37 Leaded Soldering Paste For Smd Components Low Melting Point 0