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High Solid Content Solder Liquid Flux Organic Solvent Liquid Acid Flux For Electronic
| Place of Origin | China |
|---|---|
| Brand Name | Wuxi Top Chemical |
| Certification | ISO9001 |
| Model Number | THC11 |
| Minimum Order Quantity | 10 tons |
| Price | Call/negotiable |
| Packaging Details | 1 container |
| Delivery Time | 5-8 days |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability | 500 tons/month |
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xProduct Details
| Appearance | Light Yellow, Clear And Transparent Liquid | Odor | Organic Solvent |
|---|---|---|---|
| Insulation Resistance | >108Ω | Solid Content (w/w) | 12.0±0.5 |
| P H Value | Weak Acid | Specific Gravity (g/ml) | 0.810±0.008 |
| Corrosive | No Corrosive Penetration | Storage Time | 12 Months |
| High Light | High solid content Solder Liquid Flux,Solder Liquid Flux organic solvent,liquid acid flux for electronic products |
||
Product Description
Special flux for electronic products High solid content and high activity flux
1. Introduction
△ TUOPU THC11 flux is a flux with high solid content (12% solid content) and higher activity. It can be used in foaming, spraying and other forms.
△ The resin active system has excellent wettability on the surface of bare copper and solder layer.
△ The welding of multi-layer boards with metallized small holes will show excellent penetration performance.
2. Features and advantages
△ Some special activators added to THC11 flux are used to reduce the surface tension between the solder mask and the solder, which greatly reduces the generation of solder balls.
△ The heat-stable activator in the high-solid no-clean flux reduces the incidence of continuous soldering defects in wave soldering and selective soldering.
3. Instructions for use
△ In order to meet the requirements of stable welding performance and electrical performance reliability, the process establishment related to circuit boards and components must meet the requirements of weldability and ion clarity. It is recommended that the assembler put forward relevant regulations on the suppliers of related materials and require the incoming material analysis certificate or the assembler to carry out incoming material inspection.
△ The circuit board should be handled carefully during the assembly process, and only the edges of the circuit board should be grasped. It is recommended to use clean, lint-free gloves.
△ Use FD5050 thinner to regularly clean the conveyor belt, chain teeth and fixtures to avoid the increase of residues on the edge of the circuit board after assembly.
4.Health and safety
△ Pay attention to protection during use to avoid prolonged skin contact and direct eye contact with flux. If it touches the eyes, please rinse with plenty of clean water and seek medical attention as soon as possible.
△ THC11 flux contains flammable solvents (flash point is 14 degrees Celsius), and should not be exposed to fire sources or near equipment without fire prevention measures.
5. Hazard identification data
| Cause of defect | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 |
| Missing | √ | √ | √ | |||||||
| Duoxi Webbing | √ | √ | √ | √ | √ | |||||
| Tin Cave Viods | √ | |||||||||
| Pingoles | √ | √ | ||||||||
| Lcicles | √ | √ | √ | √ | √ | √ | √ | |||
| Coarse tin Graing | √ | |||||||||
| Bridging | √ | √ | √ | √ | ||||||
| Balling | √ | √ | √ | √ | √ | |||||
| Short circuit Shorts | √ | √ | √ |
Note: √ means possible cause 1. Poor contact between the flux and the bottom plate; improper contact angle of the bottom plate solder 2. The specific gravity of the flux is too high or too low 3. The speed of the conveyor belt is too fast or too slow. Glossy; if it is too slow, it will be slightly round and thick. 4. Too much anti-oxidation oil or deterioration in the tin furnace. 5. The preheating temperature is too high or too low. 6. The temperature of the tin furnace is too high or too low. And short and thick, too low to be thin and sharp and shiny 7. The solder furnace wave crest is unstable 8. The solder in the tin furnace contains impurities 9. The component wiring direction and arrangement are poor. 10. The original board lead is improperly handled.
6.Solder Liquid Flux picture
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