High Solid Content Liquid Rosin Wave Soldering Flux 0.81 Special Gravity
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|Product Name||Soldering Fluid Flux||Appearance||Light Yellow, Clear And Transparent Liquid|
|Odor||Organic Solvent||Insulation Resistance||>108Ω|
|Solid Content (w/w)||12.0±0.5||P H Value||Weak Acid|
|Acid Value (mg KOH/g)||25±5||Specific Gravity (g/ml)||0.810±0.008|
|Chlorine Content (%)||0||Corrosive||No Corrosive Penetration|
|Suggested Thinner||FD5050 Thinner||Flash Point (T.C.C)||14℃|
|Storage Time||12 Months|
High solid content wave soldering flux,
wave soldering flux 0.81 Special gravity,
liquid rosin soldering flux transparent
High solid content Solder Liquid flux light yellow clear and transparent liquid flux
△ TUOPU THC11 flux is a flux with high solid content (12% solid content) and higher activity. It can be used in foaming, spraying and other forms.
△ The resin active system has excellent wettability on the surface of bare copper and solder layer.
△ The welding of multi-layer boards with metallized small holes will show excellent penetration performance.
2. Features and advantages
△ Some special activators added to THC11 flux are used to reduce the surface tension between the solder mask and the solder, which greatly reduces the generation of solder balls.
△ The heat-stable activator in the high-solid no-clean flux reduces the incidence of continuous soldering defects in wave soldering and selective soldering.
3. Instructions for use
△ In order to meet the requirements of stable welding performance and electrical performance reliability, the process establishment related to circuit boards and components must meet the requirements of weldability and ion clarity. It is recommended that the assembler put forward relevant regulations on the suppliers of related materials and require the incoming material analysis certificate or the assembler to carry out incoming material inspection.
△ The circuit board should be handled carefully during the assembly process, and only the edges of the circuit board should be grasped. It is recommended to use clean, lint-free gloves.
△ Use FD5050 thinner to regularly clean the conveyor belt, chain teeth and fixtures to avoid the increase of residues on the edge of the circuit board after assembly.
△ When changing the type of flux, use FD5050 thinner to thoroughly clean the flux container, flux tank, flux spray system, etc.
△ The density and uniformity of the flux coating is a key influence on the successful application of no-clean flux. It is recommended to use a flux coating with a density of 1000 to 2500 micrograms per square inch.
△ Preheating makes the flux on the circuit board dry, enhancing the removal of oxides and the formation of good solder joints. The preheating temperature depends on various factors, such as conveyor speed, types of devices and substrates.
△ When using foam coating, use compressed air with degreasing and dewatering to foam, so that enough flux is maintained on the foam core. Use a pressure regulator to adjust the air pressure to produce uniform bubbles and optimal height.
△ The flux applicator needs to add a thinner to supplement the evaporation loss and maintain the balance of the flux composition.
△ Debris and contaminants will accumulate in the circulating flux coating. For the consistency of the soldering operation, the no longer used flux should be disposed of regularly. After emptying the flux, use the thinner to clean the container and other tasks, and then fill the container with fresh flux. The flux should be allowed to foam and stabilize for a few minutes before the soldering can be resumed.
4. Technical indicators
|Parameter||Typical Value||Parameter||Typical Value|
|Appearance||light yellow, clear and transparent liquid||Specific gravity (g/ml)||0.810±0.008|
|Odor||organic solvent||Chlorine content (%)||0|
|Insulation resistance||>108Ω||Corrosive||no corrosive penetration|
|Solid content (w/w)||12.0±0.5||Suggested thinner||FD5050 thinner|
|p H value||weak acid||Flash point (T.C.C)||14℃|
|Acid value (mg KOH/g)||25±5||Storage time||12 months|
5. Hazard identification data
|Cause of defect||1||2||3||4||5||6||7||8||9||10|
|Tin Cave Viods||√|
|Coarse tin Graing||√|
|Short circuit Shorts||√||√||√|
Note: √ means possible cause 1. Poor contact between the flux and the bottom plate; improper contact angle of the bottom plate solder 2. The specific gravity of the flux is too high or too low 3. The speed of the conveyor belt is too fast or too slow. Glossy; if it is too slow, it will be slightly round and thick. 4. Too much anti-oxidation oil or deterioration in the tin furnace. 5. The preheating temperature is too high or too low. 6. The temperature of the tin furnace is too high or too low. And short and thick, too low to be thin and sharp and shiny 7. The solder furnace wave crest is unstable 8. The solder in the tin furnace contains impurities 9. The component wiring direction and arrangement are poor. 10. The original board lead is improperly handled.
6.Health and safety
△ The work area should be equipped with a suitable exhaust device to remove the flux. A large amount of inhalation of flux solvents and active agent volatiles that volatilize at soldering temperature can cause headaches, dizziness and nausea. △ The outlet of the wave soldering equipment must be equipped with an exhaust device to completely remove the volatiles.
△ Pay attention to protection during use to avoid prolonged skin contact and direct eye contact with flux. If it touches the eyes, please rinse with plenty of clean water and seek medical attention as soon as possible.
△ THC11 flux contains flammable solvents (flash point is 14 degrees Celsius), and should not be exposed to fire sources or near equipment without fire prevention measures.
7.Solder Liquid Flux picture