High Activity Solder Liquid Flux Water Soluble 25 Mg KOH/G For Wave Soldering
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|Product Name||High Solid Flux||Odor||Organic Solvent|
|Solid Content (w/w)||12.0±0.5||Acid Value (mg KOH/g)||25±5|
|Chlorine Content (%)||0||Corrosive||No Corrosive Penetration|
|Suggested Thinner||FD5050 Thinner||Storage Time||12 Months|
High activity Solder Liquid Flux,
Solder Liquid Flux 25 mg KOH/g,
water soluble flux 12 percent solid
Special flux for wave soldering of electronic products High activity and high solid content flux
△ TUOPU THC11 flux is a flux with high solid content (12% solid content) and higher activity. It can be used in foaming, spraying and other forms.
△ The resin active system has excellent wettability on the surface of bare copper and solder layer.
△ The welding of multi-layer boards with metallized small holes will show excellent penetration performance.
2. Features and advantages
△ Some special activators added to THC11 flux are used to reduce the surface tension between the solder mask and the solder, which greatly reduces the generation of solder balls.
△ The heat-stable activator in the high-solid no-clean flux reduces the incidence of continuous soldering defects in wave soldering and selective soldering.
3.Health and safety
△ THC11 flux contains flammable solvents (flash point is 14 degrees Celsius), and should not be exposed to fire sources or near equipment without fire prevention measures.
4. Technical indicators
|Parameter||Typical Value||Parameter||Typical Value|
|Appearance||light yellow, clear and transparent liquid||Specific gravity (g/ml)||0.810±0.008|
|Odor||organic solvent||Chlorine content (%)||0|
|Insulation resistance||>108Ω||Corrosive||no corrosive penetration|
|Solid content (w/w)||12.0±0.5||Suggested thinner||FD5050 thinner|
|p H value||weak acid||Flash point (T.C.C)||14℃|
|Acid value (mg KOH/g)||25±5||Storage time||12 months|
5. Hazard identification data
|Cause of defect||1||2||3||4||5||6||7||8||9||10|
|Tin Cave Viods||√|
|Coarse tin Graing||√|
|Short circuit Shorts||√||√||√|
Note: √ means possible cause 1. Poor contact between the flux and the bottom plate; improper contact angle of the bottom plate solder 2. The specific gravity of the flux is too high or too low 3. The speed of the conveyor belt is too fast or too slow. Glossy; if it is too slow, it will be slightly round and thick. 4. Too much anti-oxidation oil or deterioration in the tin furnace. 5. The preheating temperature is too high or too low. 6. The temperature of the tin furnace is too high or too low. And short and thick, too low to be thin and sharp and shiny 7. The solder furnace wave crest is unstable 8. The solder in the tin furnace contains impurities 9. The component wiring direction and arrangement are poor. 10. The original board lead is improperly handled.
6.Solder Liquid Flux picture