108 Ohm Solution Solder Liquid Flux 12 Percent High Solid Content For Soldering Electronics

Place of Origin China
Brand Name Wuxi Top Chemical
Certification ISO9001
Model Number THC11
Minimum Order Quantity 10 tons
Price Call/negotiable
Packaging Details 1 container
Delivery Time 5-8 days
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 500 tons/month

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Product Details
Appearance Light Yellow, Clear And Transparent Liquid Insulation Resistance >108Ω
Solid Content (w/w) 12.0±0.5 P H Value Weak Acid
Acid Value (mg KOH/g) 25±5 Specific Gravity (g/ml) 0.810±0.008
Corrosive No Corrosive Penetration Flash Point (T.C.C) 14℃
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108 ohm solution Solder Liquid Flux


Solder Liquid Flux 12 solid content


liquid flux for soldering electronics ISO9001

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Product Description

High activity and high solid content flux special flux for wave soldering of electronic products

1. Introduction
△ TUOPU THC11 flux is a flux with high solid content (12% solid content) and higher activity. It can be used in foaming, spraying and other forms.
△ The resin active system has excellent wettability on the surface of bare copper and solder layer.
△ The welding of multi-layer boards with metallized small holes will show excellent penetration performance.

2. Features and advantages
△ Some special activators added to THC11 flux are used to reduce the surface tension between the solder mask and the solder, which greatly reduces the generation of solder balls.
△ The heat-stable activator in the high-solid no-clean flux reduces the incidence of continuous soldering defects in wave soldering and selective soldering.


3. Technical indicators

Parameter Typical Value
Appearance light yellow, clear and transparent liquid
Odor organic solvent
Insulation resistance >108Ω
 Solid content (w/w)  12.0±0.5
 Flash point (T.C.C)  14℃
Acid value (mg KOH/g) 25±5
Specific gravity (g/ml) 0.810±0.008
Suggested thinner FD5050 thinner
Storage time 12 months


4. Hazard identification data

Cause of defect 1 2 3 4 5 6 7 8 9 10
Duoxi Webbing          
Tin Cave Viods                  
Coarse tin Graing                  
Short circuit Shorts              

Note: √ means possible cause 1. Poor contact between the flux and the bottom plate; improper contact angle of the bottom plate solder 2. The specific gravity of the flux is too high or too low 3. The speed of the conveyor belt is too fast or too slow. Glossy; if it is too slow, it will be slightly round and thick. 4. Too much anti-oxidation oil or deterioration in the tin furnace. 5. The preheating temperature is too high or too low. 6. The temperature of the tin furnace is too high or too low. And short and thick, too low to be thin and sharp and shiny 7. The solder furnace wave crest is unstable 8. The solder in the tin furnace contains impurities 9. The component wiring direction and arrangement are poor. 10. The original board lead is improperly handled.



5.Solder Liquid Flux picture
108 Ohm Solution Solder Liquid Flux 12 Percent High Solid Content For Soldering Electronics 0