ECO Liquid Solder For Circuit Boards 0.795 Gravity Wave Soldering

Place of Origin China
Brand Name Wuxi Top Chemical
Certification ISO9001
Model Number X-215
Minimum Order Quantity 10 tons
Price Call/negotiable
Packaging Details 1 container
Delivery Time 5-8 days
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 500 tons/month

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Product Details
Product Name No-clean Liquid Flux Exterior Color Colorless And Transparent
Advantage Highly Active Solid Content (w/w)% 2.5±0.5 Water Solubility
Closed Flash Point 13℃ Cl- Content (W/W)% Not Detected
Acid Value (mg KOH/g) 21±3 Storage Time 12 Months
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ECO liquid solder for circuit boards


liquid solder for circuit boards ISO9001


no clean flux liquid 0.795 Gravity

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Product Description

Special flux for wave soldering of electronic products no-clean environmental protection flux


1. Introduction
* TUOPU X-215 no-clean flux is a no-clean flux with low solid content (2.5% solid content), halogen-free and higher activity. It can be used in foaming, spraying and other forms.
* Resin active system has excellent wettability on the surface of bare copper and solder layer.
* The welding of multi-layer boards with metallized small holes will show excellent penetration performance.
* After soldering, there are very few residues on the PCB surface, and the solder joints are uniform and bright and full and can be tested without cleaning.



3. Technical indicators

Parameter Typical Value Parameter Typical Value
Exterior color Colorless and transparent Advantage Higher activity
Solid content (w/w)% 2.5±0.5 water solubility Acid value (mg KOH/g) 21±3
Specific gravity (g/ml) 0.795±0.006 Insulation resistance (85℃/85%RH) >1×108Ω
Cl- content (W/W)% not detected Resistivity 35000Ω·cm
Closed flash point 13℃ Storage time 12 months


4.Common tin point problems and treatment

Cause of defect 1 2 3 4 5 6 7 8 9 10
Duoxi Webbing          
Tin Cave Viods                  
Coarse tin Graing                  
Short circuit Shorts              

Note: √ represents the possible cause
1. The flux is in poor contact with the bottom plate; the contact angle of the bottom plate solder is improper
2. The flux density is too high or too low
3. The speed of the conveyor belt is too fast or too slow. If it is too fast, it will be sharp and shiny; if it is too slow, it will be slightly round and thick.
4. Too much anti-oxidation oil or deterioration in the tin furnace
5. The preheating temperature is too high or too low
6. The temperature of the tin furnace is too high or too low, if it is too high, it will be slightly round and stubby, and if it is too low, it will be sharp and shiny.
7, the tin furnace wave crest is unstable
8. The solder in the tin furnace contains impurities
9. Poor wiring direction and arrangement of components
10. Improper handling of the leads of the original bottom plate


 5.  No-clean flux picture                                                                                                                                                         

 ECO Liquid Solder For Circuit Boards 0.795 Gravity Wave Soldering 0