High Activity Water Soluble Liquid Rosin Soldering Flux Halogen Free
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xAppearance Color | Light Yellow And Transparent | Solid Content (WT/WT)% | 5±1 |
---|---|---|---|
Specific Gravity@20℃ | 0.803±0.008 | Closed Flash Point | 14℃ |
Insulation Resistance (85℃/85%RH) | >1×108Ω | Advantage | Highly Active |
Cl-content (WT/WT)% | 0 | Storage Time | 12 Months |
High Light | high activity liquid rosin soldering flux,liquid rosin soldering flux 0.803 gravity,water soluble liquid flux Halogen free |
Halogen-free high-activity flux additives with better penetration performance light yellow transparent liqu
1. Introduction
1) This flux is a no-clean flux with medium solid content (4.5% solid content), halogen-free and high activity. It can be used in foaming, spraying and other forms.
2)The resin active system has excellent wettability on the surface of bare copper and solder layer.
3)The welding of multi-layer boards with metallized small holes will show excellent penetration performance.
4)The residue on the PCB surface after soldering is extremely small, and the solder joints are uniform and bright and full and can be tested without cleaning.
2. Storage method
1) Store in a cool, dry, well-ventilated place or a dangerous goods warehouse that cannot be directly exposed to sunlight.
2) The work area should have a "No Pyrotechnics" sign.
3) The storage area should be clearly marked, and designated or trained personnel are allowed to enter.
4) The empty barrels and pipelines may still have residues, and heat treatment must be carried out before cleaning.
5) Use a ventilation system that does not produce sparks.
6) Ensure that the packaging is intact to avoid the accumulation and damage of the container.
7) This product is packaged in plastic barrels with a storage period of one year. It is transported and packaged as dangerous goods.
3. Technical parameters
Parameter | Typical Value | Parameter | Typical Value |
Appearance color | light yellow and transparent | Insulation resistance (85℃/85%RH) | >1×108Ω |
Solid content (WT/WT)% | 5±1 | Water-soluble resistivity | 36000Ω·cm |
Specific gravity@20℃ | 0.803±0.008 | Silver chromate paper test | passed |
Cl-content (WT/WT)% | 0 | Suggested thinner | FD5050 thinner |
Closed flash point | 14℃ | Storage time | 12 months |
4. Common tin point problems and treatment
Cause of defect | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 |
Missing | √ | √ | √ | |||||||
Duoxi Webbing | √ | √ | √ | √ | √ | |||||
Viods | √ | |||||||||
Pingoles | √ | √ | ||||||||
Lcicles | √ | √ | √ | √ | √ | √ | √ | |||
Graing | √ | |||||||||
Bridging | √ | √ | √ | √ | ||||||
Balling | √ | √ | √ | √ | √ | |||||
Shorts | √ | √ | √ |
Note: √ represents the possible cause
1. The flux is in poor contact with the bottom plate; the contact angle of the bottom plate solder is improper
2. The flux density is too high or too low
3. The speed of the conveyor belt is too fast or too slow. If it is too fast, it will be sharp and shiny; if it is too slow, it will be slightly round and thick.
4. Too much anti-oxidation oil or deterioration in the tin furnace
5. The preheating temperature is too high or too low
6. The temperature of the tin furnace is too high or too low, if it is too high, it will be slightly round and stubby, and if it is too low, it will be sharp and shiny.
7, the tin furnace wave crest is unstable
8. The solder in the tin furnace contains impurities
9. Poor wiring direction and arrangement of components
10. Improper handling of the leads of the original bottom plate
5.Rosin Liquid Flux Picture