Light Yellow No Clean Rosin Active Flux Soldering Medium Solid Content
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|Advantages||Halogen-free||Solid Content (%)||5±1|
|Flash Point (T.C.C)||14℃||Specific Gravity @20 Degrees Celsius||0.801±0.008|
|Storage Time||12 Months||Silver Chromate Paper Test||Pass Through|
|Name||Light Yellow Flux||Recommended Thinner||FD5050 Thinner|
light yellow active flux soldering,
active flux soldering medium solid content,
no clean rosin flux ISO9001
Rosin type liquid flux light yellow liquid medium solid content flux
1. Instructions for use
△ In order to meet the requirements of stable soldering performance and electrical performance reliability, the process establishment related to circuit boards and components must meet the requirements of solderability and ion clarity. It is recommended that the assembler put forward relevant regulations for the suppliers of related materials, and require the incoming material analysis certificate or the assembler to carry out incoming material inspection.
△ Handle the circuit board carefully during the assembly process. Only grasp the edge of the circuit board. It is recommended to use clean, lint-free gloves.
△ Use FD5050 thinner to clean the conveyor belt, chain teeth and clamps regularly to avoid the increase of residues on the edge of the circuit board after assembly.
△ When changing the type of flux, use FD5050 thinner to thoroughly clean the flux container, flux tank, flux spray system, etc.
△ The density and uniformity of the flux coating is a key influence on the successful application of no-clean flux. It is recommended to use a flux coating with a density of 500 to 1500 micrograms per square inch.
2. Technical parameters
Light yellow Transparent
|insulation impedance (85 ° C /85%RH)||>1×108Ω|
|Solid content (%)||5±1||
Closed flash point (T.C.C)
|water soluble resistivity||36000 ω ·cm||recommended thinner||FD5050 thinner|
|Cl-content (WT/WT)%||0||Silver Chromate Paper Test||pass through|
|storage time||12 months||Specific gravity @20 degrees Celsius||0.801±0.008|
△ Preheating makes the flux on the circuit board dry, enhancing the removal of oxides and the formation of good solder joints. The preheating temperature depends on various factors, such as conveyor speed, types of devices and substrates.
△ Using compressed air with degreasing and dewatering to foam during foam coating, so as to maintain sufficient flux on the foam core. Use a pressure regulator to adjust the air pressure to produce uniform bubbles and optimal height.
△ The flux applicator needs to add a thinner to supplement the evaporation loss and maintain the balance of the flux composition.
△ Debris and contaminants will accumulate in the flux coating of the loop. For the consistency of the soldering operation, the no longer used flux should be disposed of regularly. After emptying the flux, use the thinner to clean the container and other tasks, and then fill the container with fresh flux. The flux should be given a few minutes of foaming stability before the soldering can be resumed.
4. Flux picture