0.813 Gravity No Clean Soldering Desoldering Liquid Flux For Soldering Electronics

No-clean flux Colorless transparent liquid flux High activity halogen-free environmental protection flux

1. Introduction
◇ X-5 this product is a medium-solid content (4.5% solid content), halogen-free, high-activity no-clean flux. It can be used in foaming, spraying and other forms.
◇ Resin active system has excellent wettability on the surface of bare copper and solder layer.
◇ The welding of multi-layer boards with metallized small holes will show excellent penetration performance.
◇ There are very few residues on the PCB surface after soldering, and the solder joints are uniform and bright and full and can be tested without cleaning.

2. Features and advantages
◇ Halogen-free, high activity, medium solid content, no cleaning required, saving operating costs.
◇ Some special activators added in X-5 flux are used to reduce the surface tension between the solder mask and the solder, which greatly reduces the production of solder balls.
◇ The thermally stable activator in the medium solid content no-clean flux reduces the incidence of continuous welding defects in wave soldering and selective soldering.
◇ Very few residues, no corrosive residues, no stickiness on the plate surface after cooling, suitable for needle testing.

3. Instructions for use
◇ In order to meet the requirements of stable soldering performance and electrical performance reliability, the process establishment related to circuit boards and components must meet the requirements of solderability and ion clarity. It is recommended that the assembler put forward relevant regulations on the suppliers of related materials, and require the incoming material analysis certificate or the assembler to carry out incoming material inspection.
◇ Be careful to handle the circuit board during the assembly process. Only grasp the edge of the circuit board. It is recommended to use clean, lint-free gloves.
◇ Use X-C thinner to clean the conveyor belt, chain teeth and clamps regularly to avoid the increase of residues on the edge of the circuit board after assembly.
◇ When changing the type of flux, use X-C thinner to thoroughly clean the flux container, flux tank, flux spray system, etc.
◇ The density and uniformity of the flux coating are critical to the successful application of no-clean fluxes. It is recommended to use flux coatings with a density of 500 to 1500 micrograms per square inch.
◇ Preheating makes the flux on the circuit board dry, enhancing the removal of oxides and the formation of good solder joints. The preheating temperature depends on various factors, such as conveyor speed, types of devices and substrates.
◇ Use compressed air with degreasing and dewatering to foam when foam coating is used to maintain sufficient flux on the foam core. Use a pressure regulator to adjust the air pressure to produce uniform bubbles and optimal height.
◇ The flux applicator needs to add a thinner to supplement the evaporation loss and maintain the balance of the flux composition.
◇ Debris and contaminants will accumulate in the circulating flux coating. For the consistency of the soldering operation, the no longer used flux should be disposed of regularly. After emptying the flux, use the thinner to clean the container and other tasks, and then fill the container with fresh flux. The flux should be allowed to foam and stabilize for a few minutes before the soldering can be resumed.