138 Deg Sn42Bi58 Electrical Paste Flux Low Temperature Lead Free Solder Paste Alloy Solder

Place of Origin China
Brand Name Wuxi Top Chemical
Certification ISO9001
Model Number Sn42Bi58
Minimum Order Quantity 1 tons
Price Call/negotiable
Packaging Details 1 container
Delivery Time 5-8 days
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 50 tons/month

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Product Details
Material SnBi Melting Point 138±2°C
Specific Gravity 8.6±0.1g/cm³ Powder Particle Size 25~45μm
Single Roll Weight 500g/bottle Packing 10 Rolls/carton
Corrugated Box Size 290W*350L*215Hmm Shipment Form Put An Ice Bag Or Dry Ice In The Foam Plastic Box To Prevent High Temperature
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138 deg electrical paste flux


Sn42Bi58 electrical paste flux


low temperature lead free solder alloy

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Product Description

Lead-free low temperature solder paste Sn42Bi58 tin-bismuth alloy solder paste


This lead-free medium temperature solder paste can be provided in various alloy forms and packages, with various powder diameters, metal alloy content and viscosity adjustments. The company's technology contains active flux paste and low tin oxide powder.


1. Selected high-purity cloud tin
2. Produce strictly according to national standard
3. More than a dozen quality inspection links
4. Four quality system certification


This tin-bismuth low-temperature solder paste has an ultra-low temperature melting point of 138 degrees, which has a good protective effect on temperature-sensitive PCB boards during reflow soldering. It has high viscosity, low void rate, fast soldering, good continuous soldering, and no tin explosion. Safe and environmentally friendly.


Product parameters:

Brand TUOPU Category Lead-free low temperature solder paste
Material SnBi Melting point 138±2°C
Specific gravity 8.6±0.1g/cm³ Powder particle size 25~45μm
Single roll weight 500g/bottle Shipment form put an ice bag or dry ice in the foam plastic box to prevent high temperature
Packing 10 rolls/carton Corrugated box size 290W*350L*215Hmm



Improve yield and output High viscosity, low void rate
No-clean, low residue, excellent electrical properties Demonstrates excellent and stable printing performance on tiny pads with 0.3mm pitch
Heat resistance, wettability, stronger stability Good fluidity, not easy to cause collapse and bridging when placed or dissipated
Has excellent wettability and will not produce tin beads Low residue, no foul odor, non-corrosive
It can be placed for a long time after printing, it can be placed for 12-14 hours at room temperature The solder joints are firm, no bubbles, no cracks, smooth, bright and full


Product Image:

138 Deg Sn42Bi58 Electrical Paste Flux Low Temperature Lead Free Solder Paste Alloy Solder 0