138 Deg Sn42Bi58 Electrical Paste Flux Low Temperature Lead Free Solder Paste Alloy Solder
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xMaterial | SnBi | Melting Point | 138±2°C |
---|---|---|---|
Specific Gravity | 8.6±0.1g/cm³ | Powder Particle Size | 25~45μm |
Single Roll Weight | 500g/bottle | Packing | 10 Rolls/carton |
Corrugated Box Size | 290W*350L*215Hmm | Shipment Form | Put An Ice Bag Or Dry Ice In The Foam Plastic Box To Prevent High Temperature |
High Light | 138 deg electrical paste flux,Sn42Bi58 electrical paste flux,low temperature lead free solder alloy |
Lead-free low temperature solder paste Sn42Bi58 tin-bismuth alloy solder paste
Introduction:
This lead-free medium temperature solder paste can be provided in various alloy forms and packages, with various powder diameters, metal alloy content and viscosity adjustments. The company's technology contains active flux paste and low tin oxide powder.
Advantage:
1. Selected high-purity cloud tin
2. Produce strictly according to national standard
3. More than a dozen quality inspection links
4. Four quality system certification
This tin-bismuth low-temperature solder paste has an ultra-low temperature melting point of 138 degrees, which has a good protective effect on temperature-sensitive PCB boards during reflow soldering. It has high viscosity, low void rate, fast soldering, good continuous soldering, and no tin explosion. Safe and environmentally friendly.
Product parameters:
Brand | TUOPU | Category | Lead-free low temperature solder paste |
Material | SnBi | Melting point | 138±2°C |
Specific gravity | 8.6±0.1g/cm³ | Powder particle size | 25~45μm |
Single roll weight | 500g/bottle | Shipment form | put an ice bag or dry ice in the foam plastic box to prevent high temperature |
Packing | 10 rolls/carton | Corrugated box size | 290W*350L*215Hmm |
Features:
Improve yield and output | High viscosity, low void rate |
No-clean, low residue, excellent electrical properties | Demonstrates excellent and stable printing performance on tiny pads with 0.3mm pitch |
Heat resistance, wettability, stronger stability | Good fluidity, not easy to cause collapse and bridging when placed or dissipated |
Has excellent wettability and will not produce tin beads | Low residue, no foul odor, non-corrosive |
It can be placed for a long time after printing, it can be placed for 12-14 hours at room temperature | The solder joints are firm, no bubbles, no cracks, smooth, bright and full |
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