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120 Kgf/Cm2 High Temperature Red Glue Adhesive Smt 110 Deg Tinning Soldering
| Place of Origin | China |
|---|---|
| Brand Name | Wuxi Top Chemical |
| Certification | ISO9001 |
| Model Number | HT-130-AL |
| Minimum Order Quantity | 1 tons |
| Price | Call/negotiable |
| Packaging Details | 1 container |
| Delivery Time | 5-8 days |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability | 500 tons/month |
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xProduct Details
| Curing Conditions | See 3 Page | Copper Plate Corrosion | None |
|---|---|---|---|
| Moisture Absorption (wt%) | ≤ 1.0 | Tensile Strength (kgf/cm2) | 120 |
| Glass Transition Temperature | ≥ 110℃ | Heat Resistance (280~285℃) | 11 ~ 15 Sec |
| Adhering Strength (kg/f) | ≥ 2.0 | Storage Conditions | 5 ~ 10℃, ≤ 40% |
| High Light | 120 kgf/cm2 Red Glue Adhesive,Red Glue Adhesive 110 deg,high temperature adhesive red glue smt |
||
Product Description
Red dispensing with fixed auxiliary function, suitable for wave soldering and tinning at one time
1.Application
Bond various CHIPS on the PCB board before entering the wave soldering.
This product is especially suitable for high-speed dispensers and screen printing.
HT-130-AL red glue, epoxy resin (rapid thermal hardening effect) adhesive.
2.Reflow soldering
The Graph Below Shows a Typical Curve of Thixotropiic index of # HT-130-AL.
The Thixotropic Index Shows a Very Plateau Behavior Between 28℃ to 32℃,
Which Means That the Dot Profiles are Very Consistent in this Processing Range.
3.Curing characteristics
Recommended Conditions for Curing Chip Bond are Exposure to Temperatures Above 125℃
at 9 0 sec – 120 sec. (Recommended: 1 2 0 sec @ 130℃ or: 60-90 sec @ 150℃)
Rate of Cure and Final Strength will Depend on the Resistance time at the Cure Temperature.
4.Standard procedure
The standard process of SMT red glue production process is: screen printing→(dispensing)→placement→(curing)→reflow soldering→cleaning→testing→rework→complete
5.Physical characteristics
|
ITEM
|
RESULTS
|
Test Methods | ITEM | RESULTS | Test Methods |
| Appearance | red paste | HT-1 | Tensile strength (kgf/cm2) | 120 | HT-8-1 |
| Viscosity (poise) | 500 ~ 600 | HT-2-1 | Insulation resistance (Ω) | ≥ 1×1012 | HT-9-1 |
| Thixotropy index | ≥ 4.0 | HT-3-1 | Dielectric constant | ≤ 3.8 | HT-10-1 |
| Specific gravity | 1.0 ~ 1.4 | HT-4 | Glass transition temperature | ≥ 110℃ | HT-11 |
| Curing conditions | See 3 Page | HT-5-1 | Heat resistance (280~285℃) | 11 ~ 15 sec | HT-12-2 |
| Copper plate corrosion | None | HT-6-1 | Adhering strength (kg/f) | ≥ 2.0 | HT-13-1 |
| Moisture Absorption (wt%) | ≤ 1.0 | HT-7-1 | Storage conditions | 5 ~ 10℃, ≤ 40% | HT-14 |
6.Product Image:
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