120 Kgf/Cm2 High Temperature Red Glue Adhesive Smt 110 Deg Tinning Soldering

Place of Origin China
Brand Name Wuxi Top Chemical
Certification ISO9001
Model Number HT-130-AL
Minimum Order Quantity 1 tons
Price Call/negotiable
Packaging Details 1 container
Delivery Time 5-8 days
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 500 tons/month

Contact me for free samples and coupons.

Whatsapp:0086 18588475571

Wechat: 0086 18588475571

Skype: sales10@aixton.com

If you have any concern, we provide 24-hour online help.

Product Details
Curing Conditions See 3 Page Copper Plate Corrosion None
Moisture Absorption (wt%) ≤ 1.0 Tensile Strength (kgf/cm2) 120
Glass Transition Temperature ≥ 110℃ Heat Resistance (280~285℃) 11 ~ 15 Sec
Adhering Strength (kg/f) ≥ 2.0 Storage Conditions 5 ~ 10℃, ≤ 40%
High Light

120 kgf/cm2 Red Glue Adhesive


Red Glue Adhesive 110 deg


high temperature adhesive red glue smt

Leave a Message
Product Description

Red dispensing with fixed auxiliary function, suitable for wave soldering and tinning at one time

Bond various CHIPS on the PCB board before entering the wave soldering.
This product is especially suitable for high-speed dispensers and screen printing.


HT-130-AL red glue, epoxy resin (rapid thermal hardening effect) adhesive. 


2.Reflow soldering
The Graph Below Shows a Typical Curve of Thixotropiic index of # HT-130-AL.
The Thixotropic Index Shows a Very Plateau Behavior Between 28℃ to 32℃,
Which Means That the Dot Profiles are Very Consistent in this Processing Range.


3.Curing characteristics
Recommended Conditions for Curing Chip Bond are Exposure to Temperatures Above 125℃
at 9 0 sec – 120 sec. (Recommended: 1 2 0 sec @ 130℃ or: 60-90 sec @ 150℃)
Rate of Cure and Final Strength will Depend on the Resistance time at the Cure Temperature.


4.Standard procedure
The standard process of SMT red glue production process is: screen printing→(dispensing)→placement→(curing)→reflow soldering→cleaning→testing→rework→complete

5.Physical characteristics

Test Methods ITEM RESULTS Test Methods
Appearance  red paste HT-1 Tensile strength (kgf/cm2) 120 HT-8-1
Viscosity (poise) 500 ~ 600 HT-2-1 Insulation resistance (Ω) ≥ 1×1012 HT-9-1
Thixotropy index  ≥ 4.0 HT-3-1 Dielectric constant ≤ 3.8 HT-10-1
Specific gravity  1.0 ~ 1.4 HT-4 Glass transition temperature ≥ 110℃ HT-11
Curing conditions  See 3 Page HT-5-1 Heat resistance (280~285℃) 11 ~ 15 sec HT-12-2
Copper plate corrosion  None HT-6-1 Adhering strength (kg/f)  ≥ 2.0 HT-13-1
Moisture Absorption (wt%) ≤ 1.0 HT-7-1 Storage conditions 5 ~ 10℃, ≤ 40% HT-14

6.Product Image:

120 Kgf/Cm2 High Temperature Red Glue Adhesive Smt  110 Deg Tinning Soldering 0