Dispensing Smt 1×1012 Red Glue Adhesive Strong Viscosity For Circuit Boards

Place of Origin China
Brand Name Wuxi Top Chemical
Certification ISO9001
Model Number HT-130-AL
Minimum Order Quantity 1 tons
Price Call/negotiable
Packaging Details 1 container
Delivery Time 5-8 days
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 500 tons/month

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Product Details
Appearance Red Paste Insulation Resistance (Ω) ≥ 1×1012
Curing Conditions See 3 Page Copper Plate Corrosion None
Moisture Absorption (wt%) ≤ 1.0 Tensile Strength (kgf/cm2) 120
Glass Transition Temperature ≥ 110℃ Heat Resistance (280~285℃) 11 ~ 15 Sec
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1×1012 Red Glue Adhesive


Red Glue Adhesive strong viscosity


Dispensing smt red glue for circuit

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Product Description

Dispensing with strong viscosity and fluidity suitable for circuit boards with a small number of points

1. Application
Bond various CHIPS on the PCB board before entering the wave soldering.
This product is especially suitable for high-speed dispensers and screen printing.


2. Reflow soldering
The Graph Below Shows a Typical Curve of Thixotropiic index of # HT-130-AL.
The Thixotropic Index Shows a Very Plateau Behavior Between 28℃ to 32℃,
Which Means That the Dot Profiles are Very Consistent in this Processing Range.


3. Curing characteristics
Recommended Conditions for Curing Chip Bond are Exposure to Temperatures Above 125℃
at 9 0 sec – 120 sec. (Recommended: 1 2 0 sec @ 130℃ or: 60-90 sec @ 150℃)
Rate of Cure and Final Strength will Depend on the Resistance time at the Cure Temperature.


HT-130-AL red glue, epoxy resin (rapid thermal hardening effect) adhesive. Because it has the characteristics of vacuum packaging and "Shear-Thinning" Viscosity Characteristic, it is suitable for high-speed dispensers (40,000~40,500 points/hour). Because of its high temperature solidification (280℃-285℃) characteristics, this product Also suitable for lead-free soldering.

4.Physical characteristics

Test Methods ITEM RESULTS Test Methods
Appearance  red paste HT-1 Tensile strength (kgf/cm2) 120 HT-8-1
Viscosity (poise) 500 ~ 600 HT-2-1 Insulation resistance (Ω) ≥ 1×1012 HT-9-1
Thixotropy index  ≥ 4.0 HT-3-1 Dielectric constant ≤ 3.8 HT-10-1
Specific gravity  1.0 ~ 1.4 HT-4 Glass transition temperature ≥ 110℃ HT-11
Curing conditions  See 3 Page HT-5-1 Heat resistance (280~285℃) 11 ~ 15 sec HT-12-2
Copper plate corrosion  None HT-6-1 Adhering strength (kg/f)  ≥ 2.0 HT-13-1
Moisture Absorption (wt%) ≤ 1.0 HT-7-1 Storage conditions 5 ~ 10℃, ≤ 40% HT-14

5.Product Image:

Dispensing Smt 1×1012 Red Glue Adhesive Strong Viscosity For Circuit Boards 0