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Dispensing Smt 1×1012 Red Glue Adhesive Strong Viscosity For Circuit Boards
| Place of Origin | China |
|---|---|
| Brand Name | Wuxi Top Chemical |
| Certification | ISO9001 |
| Model Number | HT-130-AL |
| Minimum Order Quantity | 1 tons |
| Price | Call/negotiable |
| Packaging Details | 1 container |
| Delivery Time | 5-8 days |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability | 500 tons/month |
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xProduct Details
| Appearance | Red Paste | Insulation Resistance (Ω) | ≥ 1×1012 |
|---|---|---|---|
| Curing Conditions | See 3 Page | Copper Plate Corrosion | None |
| Moisture Absorption (wt%) | ≤ 1.0 | Tensile Strength (kgf/cm2) | 120 |
| Glass Transition Temperature | ≥ 110℃ | Heat Resistance (280~285℃) | 11 ~ 15 Sec |
| High Light | 1×1012 Red Glue Adhesive,Red Glue Adhesive strong viscosity,Dispensing smt red glue for circuit |
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Product Description
Dispensing with strong viscosity and fluidity suitable for circuit boards with a small number of points
1. Application
Bond various CHIPS on the PCB board before entering the wave soldering.
This product is especially suitable for high-speed dispensers and screen printing.
2. Reflow soldering
The Graph Below Shows a Typical Curve of Thixotropiic index of # HT-130-AL.
The Thixotropic Index Shows a Very Plateau Behavior Between 28℃ to 32℃,
Which Means That the Dot Profiles are Very Consistent in this Processing Range.
3. Curing characteristics
Recommended Conditions for Curing Chip Bond are Exposure to Temperatures Above 125℃
at 9 0 sec – 120 sec. (Recommended: 1 2 0 sec @ 130℃ or: 60-90 sec @ 150℃)
Rate of Cure and Final Strength will Depend on the Resistance time at the Cure Temperature.
HT-130-AL red glue, epoxy resin (rapid thermal hardening effect) adhesive. Because it has the characteristics of vacuum packaging and "Shear-Thinning" Viscosity Characteristic, it is suitable for high-speed dispensers (40,000~40,500 points/hour). Because of its high temperature solidification (280℃-285℃) characteristics, this product Also suitable for lead-free soldering.
4.Physical characteristics
|
ITEM
|
RESULTS
|
Test Methods | ITEM | RESULTS | Test Methods |
| Appearance | red paste | HT-1 | Tensile strength (kgf/cm2) | 120 | HT-8-1 |
| Viscosity (poise) | 500 ~ 600 | HT-2-1 | Insulation resistance (Ω) | ≥ 1×1012 | HT-9-1 |
| Thixotropy index | ≥ 4.0 | HT-3-1 | Dielectric constant | ≤ 3.8 | HT-10-1 |
| Specific gravity | 1.0 ~ 1.4 | HT-4 | Glass transition temperature | ≥ 110℃ | HT-11 |
| Curing conditions | See 3 Page | HT-5-1 | Heat resistance (280~285℃) | 11 ~ 15 sec | HT-12-2 |
| Copper plate corrosion | None | HT-6-1 | Adhering strength (kg/f) | ≥ 2.0 | HT-13-1 |
| Moisture Absorption (wt%) | ≤ 1.0 | HT-7-1 | Storage conditions | 5 ~ 10℃, ≤ 40% | HT-14 |
5.Product Image:
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