280C High Temperature Red Heat Resistant Glue Smt Needle Tube Adhesive Paste

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xInsulation Resistance (Ω) | ≥ 1×1012 | Thixotropy Index | ≥ 4.0 |
---|---|---|---|
Curing Conditions | See 3 Page | Copper Plate Corrosion | None |
Moisture Absorption (wt%) | ≤ 1.0 | Tensile Strength (kgf/cm2) | 120 |
Dielectric Constant | ≤ 3.8 | ||
High Light | 280C heat resistant glue,heat resistant glue Needle tube,280C high temperature red glue smt |
Polyethylene compound for fixing electronic components Needle tube red paste
HT-130-AL red glue, epoxy resin (rapid thermal hardening effect) adhesive. Because it has the characteristics of vacuum packaging and "Shear-Thinning" Viscosity Characteristic, it is suitable for high-speed dispensers (40,000~40,500 points/hour). Because of its high temperature solidification (280℃-285℃) characteristics, this product Also suitable for lead-free soldering.
1.Application:
Bond various CHIPS on the PCB board before entering the wave soldering.
This product is especially suitable for high-speed dispensers and screen printing.
2.Physical characteristics:
ITEM
|
RESULTS
|
Test Methods |
Appearance | red paste | HT-1 |
Viscosity (poise) | 500 ~ 600 | HT-2-1 |
Thixotropy index | ≥ 4.0 | HT-3-1 |
Specific gravity | 1.0 ~ 1.4 | HT-4 |
Curing conditions | See 3 Page | HT-5-1 |
Copper plate corrosion | None | HT-6-1 |
Moisture Absorption (wt%) | ≤ 1.0 | HT-7-1 |
Tensile strength (kgf/cm2) | 120 | HT-8-1 |
Insulation resistance (Ω) | ≥ 1×1012 | HT-9-1 |
Dielectric constant | ≤ 3.8 | HT-10-1 |
Glass transition temperature | ≥ 110℃ | HT-11 |
Heat resistance (280~285℃) | 11 ~ 15 sec | HT-12-2 |
Adhering strength (kg/f) | ≥ 2.0 | HT-13-1 |
Storage conditions | 5 ~ 10℃, ≤ 40% | HT-14 |
Validity period | 6 months | HT-15 |
3.Product Image: