Epoxy Resin Hot Melt Red Glue Adhesive 500 Viscosity Fast Thermosetting

Place of Origin China
Brand Name Wuxi Top Chemical
Certification ISO9001
Model Number HT-130-AL
Minimum Order Quantity 1 tons
Price Call/negotiable
Packaging Details 1 container
Delivery Time 5-8 days
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 500 tons/month

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Product Details
Appearance Red Paste Viscosity (poise) 500 ~ 600
Specific Gravity 1.0 ~ 1.4 Insulation Resistance (Ω) ≥ 1×1012
Thixotropy Index ≥ 4.0 Curing Conditions See 3 Page
Copper Plate Corrosion None Moisture Absorption (wt%) ≤ 1.0
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epoxy resin Red Glue Adhesive


Red Glue Adhesive 500 Viscosity


hot melt adhesive Fast thermosetting

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Product Description

Fast thermosetting epoxy resin adhesive red needle tube paste dispensing


product description:

HT-130-AL red glue, epoxy resin (rapid thermal hardening effect) adhesive. Because it has the characteristics of vacuum packaging and "Shear-Thinning" Viscosity Characteristic, it is suitable for high-speed dispensers (40,000~40,500 points/hour). Because of its high temperature solidification (280℃-285℃) characteristics, this product Also suitable for lead-free soldering.

Bond various CHIPS on the PCB board before entering the wave soldering.
This product is especially suitable for high-speed dispensers and screen printing.

Physical characteristics:

Test Methods
Appearance  red paste HT-1
Viscosity (poise) 500 ~ 600 HT-2-1
Thixotropy index  ≥ 4.0 HT-3-1
Specific gravity  1.0 ~ 1.4 HT-4
Curing conditions  See 3 Page HT-5-1
Copper plate corrosion  None HT-6-1
Moisture Absorption (wt%) ≤ 1.0 HT-7-1
Tensile strength (kgf/cm2) 120 HT-8-1
Insulation resistance (Ω) ≥ 1×1012 HT-9-1
Dielectric constant ≤ 3.8 HT-10-1
Glass transition temperature ≥ 110℃ HT-11
Heat resistance (280~285℃) 11 ~ 15 sec HT-12-2
Adhering strength (kg/f)  ≥ 2.0 HT-13-1
Storage conditions 5 ~ 10℃, ≤ 40% HT-14
Validity period 6 months HT-15

Product Image:

Epoxy Resin Hot Melt Red Glue Adhesive 500 Viscosity Fast Thermosetting 0